Tools Required

J 25070 Heat Gun

Important: Apply the tape for protection and alignment marks for alignment of the new emblem/nameplate.

1. Apply the tape to the area around the emblem/nameplate.



2. Heat the emblem/nameplate using the J 25070 . Apply the heat using a circular motion for about 30 seconds holding the heat gun 152 mm (6 in) from the surface.
3. Remove the emblem/nameplate from the surface using a small plastic flat-bladed tool, being careful not to damage the paint.
4. When replacing a emblem/nameplate, remove all adhesive as follows:




•	For body panels use a 3M™ Scotch Brite molding adhesive remover disk 3M™ P/N 07502 or equivalent.

•	For plastic panels use a lint-free cloth and Varnish Makers and Painters (VMP) naphtha or a (50/50 mixture) by volume of isopropyl alcohol and water to remove the adhesive.

Important: Apply the emblem/nameplate in an environment that is free from dust or other dirt that could come into contact with the sticky backing. Foreign material may cause improper adhesion.




1. Ensure the area where the emblem/nameplate will be installed is clean and dry.



2. If the location of the emblem/nameplate has not been marked apply tape and use the following dimensions:

•	88 mm (+/- 2 mm) (a) from the horizontal edge of the rear compartment lid

•	20 mm (+/- 2 mm) (b) from the vertical edge of the rear compartment lid




3. Heat the mounting surface to approximately 27-41°C (80-105°F) using the J 25070 , if necessary.
4. Ensure that the temperature of the emblem/nameplate is approximately 29-32°C (85-90°F).

Important: Do not touch the adhesive backing of the emblem/nameplate.




5. Remove the protective liner from the back of the emblem/nameplate.
6. Position the emblem/nameplate to the location marks and press the emblem/nameplate to the mounting surface.
7. Apply equal pressure along the emblem/nameplate to uniformly bond the item to the mounting surface.
8. Inspect the emblem/nameplate for bonding.

Hand roll loose ends.

9. Remove the tape from the mounting surface.